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Silicon
Silicon - Main Properties
Silicon is the fundamental material for electronics. It was at the inception of information technology and it is still universally used for semiconductor and photovoltaic applications. High purity silicon produced by float-zone method is mostly used in electronics (microchips). Doped silicon produced by a cheaper and more wide-spread Czochralski method is suitable for transistors, semiconductor detectors, solar cells, Ra- man lasers etc.

Basic properties

Ionization Energies for Various Dopants
Structure Cubic
Space Group Fd3m
Atomic weight 28.0855
Lattice spacing (a0 ) at 300K 0.54311 nm
Density at 300K 2.3290 g/ cm3
Nearest Neighbour Distance at 300K 0.235 nm
Number of atoms in 1 cm3 4.995 · 1022
Isotopes 28 (92.23%) 29 ( 4.67%) 30 ( 3.10%)
Electron Shells 1s22s22p63s23p2
Common Ions Si 4 +, Si 4 -
Critical Pressure 1450 atm
Critical Temperature 4920 °C
Dielectric Constant at 300 K 11.9
Effective density of states (conduction, Nc T=300 K ) 2.8x1019 cm-3
Effective density of states (valence, Nv T=300 K ) 1.04x1019 cm-3
Electron affinity 133.6 kJ / mol
Energy Gap Eg (Minimum Indirect Energy Gap) at 1.12 eV 300 K
Energy Gap Eg at ca. 0 K
Minimum Direct Energy Gap at 300 K 3.4 eV
Energy separation (E?L) 4.2 eV
Intrinsic Debye length 24 um
Intrinsic carrier concentration 1·1010 cm-3
Intrinsic resistivity 3.2·105 Ohm·cm
Auger recombination coefficient Cn 1.1·10-30 cm6 / s
Auger recombination coefficient Cp 3·10-31 cm6 / s
Melting point 1414 °C/ 1687 K
Boiling point 2628 K
Specific heat 0.7 J / (g x °C)
Thermal conductivity [300K] 148 W / (m x K)
Thermal diffusivity 0.8 cm2/s
Thermal expansion, linear 2.6·10-6 °C -1
Debye temperature 640 K
Temperature dependence of band gap -2.3e-4 eV/K
Heat of: fusion / vaporization / atomization 39.6 / 383.3 / 452 kJ / mol
Breakdown field ~ 3·105 V/cm
Index of refraction 3.42
Mobility electrons ~ 1400 cm2 / (V x s)
Mobility holes ~ 450 cm2 / (V x s)
Diffusion coefficient electrons ~ 36 cm2/s
Diffusion coefficient holes ~ 12 cm2/s
Electron thermal velocity 2.3·105 m/s
Electronegativity 1.8 Pauling`s
Hole thermal velocity 1.65·105 m/s
Optical phonon energy 0.063 eV
Density of surface atoms (100) 6.78 1014/cm2 (110) 9.59 1014/cm2 (111) 7.83 1014/cm2
Work function (intrinsic) 4.15 eV
Donors: Sb 0.039 eV, P 0.045 eV, As 0.054 eV
Acceptors: B 0.045 eV, Al 0.067 eV, Ga 0.072 eV, In 0.16 eV

Products

Czochralski silicon ingots for solar cells
Diameter 152.5 +/- 1,5 mm
Length 250 – 450 mm
Conductivity type, doping P, Boron
Orientation (100)
Orientation tolerance 2 °
Specific resistivity (R) 12 +/- 2.4 Ω * cm
Radial resistivity gradient (RRG) 8 %
Concentration of Oxygen 7-9x1017 cm-3
Oxigen radial gradient (ORG) 7 %
Concentration of Carbon 2.5 x1016 cm-3
Oxidative defect of the packaging 50 cm-2
Etch pit density (EPD) 102 cm-2
Twins, Swirls, Flow lines, Strata FREE
Dislocation Density 10 cm-2
Life time 48 ms
Float zone and Czochralski silicon wafers for electronics
Diameter/Width 50.8 – 101.6 mm
Thickness/Length 0.3 – 1 mm
Conductivity type / doping Intrinsic / undoped, N-type / phosphor, P-type / boron
Orientation (100), (111), (110)
Specific resistivity Low (<1 Ohm*cm); High (> 1000 Ohm * cm)
Surface quality As-cut, polished 80/50 per MIL-0-13830

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